Lee, Seungbae: search on Z-Library

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1

Diagnostic Accuracy of the Neck Tornado Test as a New Screening Test in Cervical Radiculopathy

Park, Juyeon, Park, Woo Young, Hong, Seungbae, An, Jiwon, Koh, Jae Chul, Lee, Youn-Woo, Kim, Yong Chan, Choi, Jong Bum

Journal:

International Journal of Medical Sciences

Year:

2017

Language:

english

File:

PDF, 815 KB

english, 2017

2

Spline Interface for Intuitive Skinning Weight Editing

Bang, Seungbae, Lee, Sung-Hee

Journal:

ACM Transactions on Graphics

Year:

2018

Language:

english

File:

PDF, 17.16 MB

english, 2018

3

Optimization of the Aerodynamic and Aeroacoustic Performance of an Axial-Flow Fan

Kim, Jin-Hyuk, Ovgor, Bavuudorj, Cha, Kyung-Hun, Kim, Joo-Hyung, Lee, Seungbae, Kim, Kwang-Yong

Journal:

Year:

2014

Language:

english

File:

PDF, 8.56 MB

english, 2014

4

Conductive Fiber-Based Ultrasensitive Textile Pressure Sensor for Wearable Electronics

Lee, Jaehong, Kwon, Hyukho, Seo, Jungmok, Shin, Sera, Koo, Ja Hoon, Pang, Changhyun, Son, Seungbae, Kim, Jae Hyung, Jang, Yong Hoon, Kim, Dae Eun, Lee, Taeyoon

Journal:

Advanced Materials

Year:

2015

Language:

english

File:

PDF, 1.70 MB

english, 2015

5

Data-driven physics for human soft tissue animation

Kim, Meekyoung, Pons-Moll, Gerard, Pujades, Sergi, Bang, Seungbae, Kim, Jinwook, Black, Michael J., Lee, Sung-Hee

Journal:

ACM Transactions on Graphics

Year:

2017

Language:

english

File:

PDF, 5.40 MB

english, 2017

6

[IEEE 2019 International Conference on Information and Communication Technology Convergence (ICTC) - Jeju Island, Korea (South) (2019.10.16-2019.10.18)] 2019 International Conference on Information and Communication Technology Convergence (ICTC) - Implement of Sleep Monitoring System Using UWB, PPG

Im, Seungbae, Kim, Hyebeen, Lee, Chanhee, Oh, Hyunwoo

Year:

2019

Language:

english

File:

PDF, 404 KB

english, 2019

7

[IEEE 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI) - Turin, Italy (2016.5.8-2016.5.11)] 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI) - Simulation-based analysis on EMI effect in LPDDR interface for mitigating RFI in a mobile environment

Kim, Seil, Moon, Sungwook, Lee, Seungbae, Yi, Donny, Park, Goeun, Shin, Sangchul, Pae, Sangwoo

Year:

2016

Language:

english

File:

PDF, 720 KB

english, 2016

8

Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling

Yu, Da, Lee, Hohyung, Park, Seungbae

Journal:

Journal of Electronic Packaging

Year:

2012

Language:

english

File:

PDF, 2.47 MB

english, 2012

9

Predictive Model for Optimized Design Parameters in Flip-Chip Packages and Assemblies

Park, Seungbae, Lee, H. C., Sammakia, Bahgat, Raghunathan, Karthik

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2007

Language:

english

File:

PDF, 869 KB

english, 2007

10

[IEEE 2020 IEEE International Reliability Physics Symposium (IRPS) - Dallas, TX, USA (2020.4.28-2020.5.30)] 2020 IEEE International Reliability Physics Symposium (IRPS) - Backside Alpha-Irradiation Test in Flip-Chip Package in EUV 7 nm FinFET SRAM

Uemura, Taiki, Chung, Byungjin, Jo, Jeongmin, Jiang, Hai, Ji, Yongsung, Jeong, Tae-Young, Ranjan, Rakesh, Lee, Seungbae, Rhee, Hwasung, Pae, Sangwoo, Lee, Euncheol, Choi, Jaehee, Ohnishi, Shota, Machi

Year:

2020

File:

PDF, 739 KB

2020

11

[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays - Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage

Liu, Ruiyang, Lee, HoHyung, Park, Seungbae, Xue, Xiaojie

Year:

2015

Language:

english

File:

PDF, 2.65 MB

english, 2015

12

[IEEE 2020 IEEE International Reliability Physics Symposium (IRPS) - Dallas, TX, USA (2020.4.28-2020.5.30)] 2020 IEEE International Reliability Physics Symposium (IRPS) - Investigating of SER in 28 nm FDSOI-Planar and Comparing with SER in Bulk-FinFET

Uemura, Taiki, Chung, Byungjin, Jo, Jeongmin, Jiang, Hai, Ji, Yongsung, Jeong, Tae-Young, Ranjan, Rakesh, Park, Youngin, Hong, Kiil, Lee, Seungbae, Rhee, Hwasung, Pae, Sangwoo, Lee, Euncheol, Choi, Ja

Year:

2020

File:

PDF, 599 KB

2020

13

[IEEE 2018 IEEE International Reliability Physics Symposium (IRPS) - Burlingame, CA (2018.3.11-2018.3.15)] 2018 IEEE International Reliability Physics Symposium (IRPS) - Investigation of alpha-induced single event transient (SET) in 10 nm FinFET logic circuit

Uemura, Taiki, Lee, Soonyoung, Min, Dahye, Moon, Ihlhwa, Lim, Jungman, Lee, Seungbae, Sagong, Hyun Chul, Pae, Sangwoo

Year:

2018

Language:

english

File:

PDF, 352 KB

english, 2018

14

65-1: Maximum Comfortable Luminance of Head Mounted Display under Various Surround Illuminances

Ha, Hyeyoung, Kwak, Youngshin, Kim, Hyosun, Seo, Young-jun, Lee, Seungbae, Jo, Sung-Chan

Journal:

SID Symposium Digest of Technical Papers

Year:

2018

Language:

english

File:

PDF, 1.37 MB

english, 2018

15

Interactive Rigging with Intuitive Tools

Bang, Seungbae, Choi, Byungkuk, Blanco i Ribera, Roger, Kim, Meekyoung, Lee, Sung-Hee, Noh, Junyong

Journal:

Computer Graphics Forum

Year:

2015

Language:

english

File:

PDF, 15.48 MB

english, 2015

16

Shaping Rollable Display Devices: Effects of Gripping Condition, Device Thickness, and Hand Length on Bimanual Perceived Grip Comfort

Lee, Songil, Kyung, Gyouhyung, Kim, Minjoong, Choi, Donghee, Choi, Hyeeun, Hwang, Kitae, Park, Seonghyeok, Kim, Su Young, Lee, Seungbae

Journal:

Human Factors The Journal of the Human Factors and Ergonomics Society

Year:

2019

File:

PDF, 1.02 MB

2019

17

Investigation of Stress in MEMS Sensor Device Due to Hygroscopic and Viscoelastic Behavior of Molding Compound

Yeonsung Kim,, Dapeng Liu,, Hohyung Lee,, Ruiyang Liu,, Sengupta, Dipak, Seungbae Park,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2015

Language:

english

File:

PDF, 4.27 MB

english, 2015

18

An Eulerian approach for constructing a map between surfaces with different topologies

Park, Hangil, Cho, Youngjin, Bang, Seungbae, Lee, Sung-Hee

Journal:

Computer Graphics Forum

Year:

2016

Language:

english

File:

PDF, 9.06 MB

english, 2016

19

Gain enhancement of a microstrip patch antenna using a circularly periodic EBG structure and air layer

Seungbae Park, Cheolbok Kim, Youngho Jung, Hosang Lee, Dongki Cho, Munsoo Lee

Journal:

AEU - International Journal of Electronics and Communications

Year:

2010

Language:

english

File:

PDF, 931 KB

english, 2010

20

66-4: Effects of Display Curvature and Lateral Viewing Position on Spatial Presence and Image Quality for 55″ TVs

Park, Sungryul, Yi, Jihhyeon, Choi, Donghee, Lee, Songil, Kyung, Gyouhyung, Choi, Byeonghwa, Lee, Ja Eun, Lee, Seungbae

Journal:

SID Symposium Digest of Technical Papers

Year:

2016

Language:

english

File:

PDF, 582 KB

english, 2016

21

Exfoliation and Characterization of V2Se9 Atomic Crystals

Kim, Bum, Jeong, Byung, OH, Seungbae, Chae, Sudong, Choi, Kyung, Nasir, Tuqeer, Lee, Sang, Kim, Kwan-Woo, Lim, Hyung, Choi, Ik, Moon, Ji-Yun, Yu, Hak, Lee, Jae-Hyun, Choi, Jae-Young

Journal:

Year:

2018

Language:

english

File:

PDF, 2.26 MB

english, 2018

22

Effects of display curvature and task duration on proofreading performance, visual discomfort, visual fatigue, mental workload, and user satisfaction

Park, Sungryul, Kyung, Gyouhyung, Choi, Donghee, Yi, Jihhyeon, Lee, Songil, Choi, Byeonghwa, Lee, Seungbae

Journal:

Applied Ergonomics

Year:

2019

Language:

english

File:

PDF, 5.87 MB

english, 2019

23

Effects of Compression and Expansion on Turbulence Intensity in Supersonic Boundary Layers

Kim, Jin-Hwa, Samimy, M., Lee, Seungbae

Journal:

Year:

2001

Language:

english

File:

PDF, 290 KB

english, 2001

24

Review of the F-16 Individual Aircraft Tracking Program

Lee, Hongchul, Cho, Hwanjeong, Park, Seungbae

Journal:

Journal of Aircraft

Year:

2012

Language:

english

File:

PDF, 2.83 MB

english, 2012

25

Active control of flow noise sources in turbulent boundary layer on a flat-plate using piezoelectric bimorph film

Woo-Seog Song, Seungbae Lee, Dong-Shin Shin, Yang Na

Journal:

Journal of Mechanical Science and Technology

Year:

2006

File:

PDF, 1.02 MB

2006

26

Where to put the creases? Interactions between hand length, task, screen size, and folding method on the suitability of hand-held foldable display devices

Lee, Songil, Kyung, Gyouhyung, Choi, Donghee, Yi, Jihhyeon, Kim, Minjoong, Choi, Byeonghwa, Lee, Seungbae

Journal:

Year:

2019

Language:

english

File:

PDF, 1.27 MB

english, 2019

27

Design guideline on board-level thermomechanical reliability of 2.5D package

Shao, Shuai, Niu, Yuling, Wang, Jing, Liu, Ruiyang, Park, Seungbae, Lee, Hohyung, Yip, Laurene, Refai-Ahmed, Gamal

Journal:

Microelectronics Reliability

Year:

2020

File:

PDF, 4.67 MB

2020

28

Dynamic responses of PCB under product-level free drop impact

Da Yu, Jae B. Kwak, Seungbae Park, John Lee

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 2.08 MB

english, 2010

29

Large eddy simulation of aerosound using homogeneous turbulence as example

Lee, Seungbae, Meecham, William C.

Journal:

The Journal of the Acoustical Society of America

Year:

1992

File:

PDF, 726 KB

1992

30

Determining Ergonomic Smartphone Forms With High Grip Comfort and Attractive Design

Lee, Songil, Kyung, Gyouhyung, Yi, Jihhyeon, Choi, Donghee, Park, Sungryul, Choi, Byeonghwa, Lee, Seungbae

Journal:

Human Factors The Journal of the Human Factors and Ergonomics Society

Year:

2018

Language:

english

File:

PDF, 479 KB

english, 2018

31

Optimal Material Properties of Molding Compounds for MEMS Package

Kim, Yeonsung, Lee, Hohyung, Zhang, Xin, Park, Seungbae

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2014

Language:

english

File:

PDF, 2.74 MB

english, 2014

32

Effect of glue on reliability of flip chip BGA packages under thermal cycling

Tung T. Nguyen, Donggun Lee, Jae B. Kwak, Seungbae Park

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 1.15 MB

english, 2010

33

Sensors: Conductive Fiber-Based Ultrasensitive Textile Pressure Sensor for Wearable Electronics (Adv. Mater. 15/2015)

Lee, Jaehong, Kwon, Hyukho, Seo, Jungmok, Shin, Sera, Koo, Ja Hoon, Pang, Changhyun, Son, Seungbae, Kim, Jae Hyung, Jang, Yong Hoon, Kim, Dae Eun, Lee, Taeyoon

Journal:

Advanced Materials

Year:

2015

File:

PDF, 2.91 MB

2015

34

[IEEE 2015 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2015.4.19-2015.4.23)] 2015 IEEE International Reliability Physics Symposium - CPI reliability and EMI benefit for MIM CAP embedded C4 package

Chun, Hyunsuk, Baick, In Hak, Ha, Sang-Su, Kwon, Eunmi, Lee, Seungbae, Kim, Seil, Pae, Sangwoo, Park, Jongwoo

Year:

2015

Language:

english

File:

PDF, 470 KB

english, 2015

35

Wall pressure fluctuations and radiated sound from turbulent boundary layer on an axisymmetric body

Lee, Seungbae, Kim, Hooi-Joong, Kwon, O-Sup, Lee, Sang-Kwon

Journal:

Acoustics Research Letters Online

Year:

2000

Language:

english

File:

PDF, 506 KB

english, 2000

36

B3-3　Formative Evaluation of Diverse Flexible Display Product Concepts Using Mock-Ups and Strategy Canvas

Kim, Minjoong, Yi, Jihhyeon, Lee, Songil, Choi, Donghee, Park, Sungryul, Kyung, Gyouhyung, Choi, Byeonghwa, Lee, Seungbae

Year:

2017

Language:

english

File:

PDF, 683 KB

english, 2017

37

Raman scattering of true 1D van der Waals Nb 2 Se 9 nanowires

Lee, Junho, Kim, Bum Jun, Chung, You Kyoung, Lee, WeonâGyu, Choi, Ik Jun, Chae, Sudong, Oh, Seungbae, Kim, Ji Man, Choi, JaeâYoung, Huh, Joonsuk

Journal:

Journal of Raman Spectroscopy

Year:

2020

File:

PDF, 2.57 MB

2020

38

Supersonic jet noise control via trailing edge modifications

Jin-Hwa Kim, Seungbae Lee

Journal:

Journal of Mechanical Science and Technology

Year:

2001

Language:

english

File:

PDF, 955 KB

english, 2001

39

Series-resonant VHF micromechanical resonator reference oscillators

Yu-Wei Lin, Seungbae Lee, Sheng-Shian Li, Yuan Xie, Zeying Ren, Nguyen, C.T.-C.

Journal:

IEEE Journal of Solid-State Circuits

Year:

2004

Language:

english

File:

PDF, 1.58 MB

english, 2004

40

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Temperature dependency of coefficient of hygroscopic swelling of molding compound

Park, Seungbae, Haojun Zhang,, Xin Zhang,, Siu Lung Ng,, Ho Chong Lee,

Year:

2009

Language:

english

File:

PDF, 952 KB

english, 2009

41

Balanced Interfacial Interactions for Fluoroacrylic Block Copolymer Films and Fast Electric Field Directed Assembly

Jo, Seongjun, Jeon, Seungbae, Kim, Hwiesoo, Ryu, Chang Y., Lee, Seungwoo, Ryu, Du Yeol

Journal:

Chemistry of Materials

Year:

2020

File:

PDF, 8.37 MB

2020

42

Acoustic scaling of an axial fan with non-uniform inlet flows

Seungbae Lee, Gwi-Chul Yang

Journal:

Journal of Mechanical Science and Technology

Year:

1999

Language:

english

File:

PDF, 1.06 MB

english, 1999

43

[IEEE 2011 Joint conference of the IEEE International Frequency Control and the European Frequency and Time Forum (FCS) - San Francisco, CA, USA (2011.05.2-2011.05.5)] 2011 Joint Conference of the IEEE International Frequency Control and the European Frequency and Time Forum (FCS) Proceedings - Reliability of next generation high performance pMEMS™ resonator oscillators

Bhugra, Harmeet, Lee, Seungbae, Pan, Wanling, Wang, Ye, Lei, Dino

Year:

2011

Language:

english

File:

PDF, 733 KB

english, 2011

44

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Package embedded decoupling capacitor impact on core power delivery network for ARM SoC application

Kim, GaWon, Min, Max Sunghwan, Yang, Melinda Ling, Gundurao, Anil, You, Eileen, Gill, Harpreet, Cha, Seungyong, Kim, Younghoon, You, Se-ho, Lee, Seungbae, Ryu, Woonghwan

Year:

2014

Language:

english

File:

PDF, 1.63 MB

english, 2014

45

New RGB primary for various multimedia systems

Ryu, Byongtae, Kim, Kyoungtae, Ha, Youngsang, Bae, Jaewoo, Lee, Seungbae, Song, Junho, Lee, Kiyong, Lee, Jangdoo, Kim, Kyeonghyeon, Kim, Haksun

Journal:

Journal of Information Display

Year:

2014

Language:

english

File:

PDF, 411 KB

english, 2014

46

Carbon-ZnO core-shell nanospheres: Facile fabrication and application in the visible-light photocatalytic decomposition of organic pollutant dyes

Shima, Hossain, Hossain, Muhammad M., Lee, Insup, Son, Seungbae, Hahn, Jae R.

Journal:

Materials Chemistry and Physics

Year:

2016

Language:

english

File:

PDF, 2.26 MB

english, 2016

47

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Product Level Design Optimization for 2.5D Package Pad Cratering Reliability During Drop Impact

Wang, Huayan, Wang, Jing, Xu, Jiefeng, Pham, Vanlai, Pan, Ke, Park, Seungbae, Lee, Hohyung, Refai-Ahmed, Gamal

Year:

2019

Language:

english

File:

PDF, 689 KB

english, 2019

48

Prediction of thermoacoustic instability in Rijke tube using CFD-CAA numerical method

Woo-Seog Song, Seungbae Lee, Dong-Shin Shin

Journal:

Journal of Mechanical Science and Technology

Year:

2011

Language:

english

File:

PDF, 591 KB

english, 2011

49

[IEEE 2011 IEEE International Electron Devices Meeting (IEDM) - Washington, DC, USA (2011.12.5-2011.12.7)] 2011 International Electron Devices Meeting - High Performance pMEMS™ oscillators - The next generation frequency references

Bhugra, Harmeet, Ye Wang,, Wanling Pan,, Dino Lei,, Seungbae Lee,

Year:

2011

Language:

english

File:

PDF, 2.52 MB

english, 2011

50

Multi-resistive Reduced Graphene Oxide Diode with Reversible Surface Electrochemical Reaction induced Carrier Control

Seo, Hyungtak, Ahn, Seungbae, Kim, Jinseo, Lee, Young-Ahn, Chung, Koo-Hyun, Jeon, Ki-Joon

Journal:

Scientific Reports

Year:

2014

Language:

english

File:

PDF, 840 KB

english, 2014

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